Tekniker

Process for deep etching on silicon

Objective

To manufacture arrays of columns and holes with high aspect ratios.

Results

Microfluidic devices with high-aspect ratio structures.

Process for deep attack on silicon

There are applications such as the separation of cells by size, which require the manufacture of columns with high aspect ratios. To this end, it is necessary to achieve deep and anisotropic etching processes, obtained by a combined and multiplexed process of passivation steps with a C4F8 plasma and etching steps employing a SF6 plasma.

These types of processes can also be used for manufacturing microelectromechanical systems (MEMS).

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