Process for deep etching on silicon

There are applications such as the separation of cells by size, which require the manufacture of columns with high aspect ratios. To this end, it is necessary to achieve deep and anisotropic etching processes, obtained by a combined and multiplexed process of passivation steps with a C₄F₈ plasma and etching steps employing a SF₆ plasma.

These types of processes can also be used for manufacturing microelectromechanical systems (MEMS).