Nickel stamps for roll to roll processes
To manufacture flexible microstructured substrates for roll to roll processes.
Obtaining flexible nickel stamps.
Electrodeposition can be employed in electroforming processes in which the metal deposited is separated from the substrate on which the former is deposited.
In this case, it is based on microstructured silicon moulds (with features of up to 5 µm) on which a fine layer of conducting material (copper) is deposited by a PVD (Physical Vapour Deposition) process.
In the process of electrodeposition, there is a growth of 100 µm of nickel, in such a way that this material presents sufficient flexibility to be able to be assembled on the roll and to carry out roll-to-roll printing processes of proteins.