Tekniker

Nickel stamps for roll to roll processes

Objective

To manufacture flexible microstructured substrates for roll to roll processes.

Results

Obtaining flexible nickel stamps.

Nickel stamps for roll to roll processes

Electrodeposition can be employed in electroforming processes in which the metal deposited is separated from the substrate on which the former is deposited.

In this case, it is based on microstructured silicon moulds (with features of up to 5 µm) on which a fine layer of conducting material (copper) is deposited by a PVD (Physical Vapour Deposition) process.

In the process of electrodeposition, there is a growth of 100 µm of nickel, in such a way that this material presents sufficient flexibility to be able to be assembled on the roll and to carry out roll-to-roll printing processes of proteins.

This site uses cookies

We use cookies to improve the browsing experience and provide our services to you.

If you continue browsing, we consider that you accept their use.

If you wish to obtain additional information, please query our Cookies policy.

Accept